Techcombank gets go-ahead to issue bonds

Wednesday, May 21, 2008
State Bank of Viet Nam's governor on May 15 issued the Decision No 1093/QD-NHNN approving Viet Nam Technological and Commercial Joint Stock Bank (Techcombank) to issue bonds with a total value of five trillion dong with the coupon rate matched with the market level in 2008.

Techcombank must comply with SBV's current regulations and legal documents relating to bond issue to foreign institutions and individuals.

Additionally, the decision also rules that Techcombank's bond issue in 2008 must be under the regulation on credit institutions' valuable papers for domestic capital mobilisation enclosed with Decision No 07/2008/QD-NHNN dated March 24, 2008.